Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8030747 | Stacked package and method of manufacturing the same | Won-Hwa Lee | 2011-10-04 |
| 7972902 | Method of manufacturing a wafer including providing electrical conductors isolated from circuitry | Sunpil Youn | 2011-07-05 |
| 7888806 | Electrical connections for multichip modules | Min Woo KIM | 2011-02-15 |