Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8043892 | Semiconductor die package and integrated circuit package and fabricating method thereof | Jae Hyuck Lee | 2011-10-25 |
| 8045331 | Printed circuit board, method of fabricating the same, and electronic apparatus employing the same | Ho-Seong Seo, Young-Min Lee | 2011-10-25 |