Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7989939 | Semiconductor package which includes an insulating layer located between package substrates which may prevent an electrical short caused by a bonding wire | Hyun-Ik Hwang, Yongjin Jung | 2011-08-02 |