Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8049329 | Wafer stacked package waving bertical heat emission path and method of fabricating the same | Hee Jin Lee | 2011-11-01 |
| 7880291 | Integrated circuit package and integrated circuit module | Sang Wook Park, Hyung-Gil Baek | 2011-02-01 |