WR

Willam J. Reeder

RR Round Rock Research: 1 patents #55 of 152Top 40%
📍 Boise, ID: #212 of 511 inventorsTop 45%
🗺 Idaho: #340 of 944 inventorsTop 40%
Overall (2011): #130,219 of 364,097Top 40%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7951646 Solder ball landpad design to improve laminate performance Brad D. Rumsey, Patrick W. Tandy, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard +1 more 2011-05-31