Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7986035 | Multilayer wiring substrate, semiconductor package, and method of manufacturing semiconductor package | — | 2011-07-26 |
| 7906854 | Semiconductor device having spacer formed on semiconductor chip connected with wire | — | 2011-03-15 |
| 7888809 | Semiconductor device and method of manufacturing the same | Takamitsu Noda, Hiroyasu Miyamoto, Jun Tsukano | 2011-02-15 |