Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8048718 | Semiconductor device comprising an excess resin portion, manufacturing method thereof, and apparatus for manufacturing semiconductor device comprising a excess resin portion | Toshinori Kiyohara, Yoshikazu Takada | 2011-11-01 |
| 7985624 | Method of manufacturing semiconductor device having plural dicing steps | — | 2011-07-26 |
| 7875468 | Body to be plated, method of determining plated film thickness, and method of manufacturing semiconductor device | — | 2011-01-25 |