Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7973418 | Solder bump interconnect for improved mechanical and thermo-mechanical performance | Yuan Lu, Richard Redburn | 2011-07-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7973418 | Solder bump interconnect for improved mechanical and thermo-mechanical performance | Yuan Lu, Richard Redburn | 2011-07-05 |