Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8080862 | Systems and methods for enabling ESD protection on 3-D stacked devices | Shiqun Gu, Matthew Michael Nowak | 2011-12-20 |
| 8076768 | IC interconnect | Shiqun Gu, Bart Swinnen | 2011-12-13 |
| 7985620 | Method of fabricating via first plus via last IC interconnect | Shiqun Gu, Bart Swinnen | 2011-07-26 |
| 7939926 | Via first plus via last technique for IC interconnects | Shiqun Gu, Bart Swinnen | 2011-05-10 |