Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8018051 | Thermally enhanced semiconductor package | Steven D. Cate | 2011-09-13 |
| 7982305 | Integrated circuit package including a three-dimensional fan-out / fan-in signal routing | Steven D. Cate | 2011-07-19 |