Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7932161 | Methods and materials useful for chip stacking, chip and wafer bonding | Robert A. Shick, Hendra Ng, Andrew Bell, Wei Zhang, Phil Neal | 2011-04-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7932161 | Methods and materials useful for chip stacking, chip and wafer bonding | Robert A. Shick, Hendra Ng, Andrew Bell, Wei Zhang, Phil Neal | 2011-04-26 |