Issued Patents 2011
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8051557 | Substrate with multi-layer interconnection structure and method of manufacturing the same | — | 2011-11-08 |
| 8023282 | Hybrid structure of multi-layer substrates and manufacture method thereof | — | 2011-09-20 |
| 8014164 | Hybrid structure of multi-layer substrates and manufacture method thereof | — | 2011-09-06 |
| 7993973 | Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structure | — | 2011-08-09 |
| 7948079 | Method of manufacturing hybrid structure of multi-layer substrates and hybrid structure thereof | — | 2011-05-24 |
| 7947573 | Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structure | — | 2011-05-24 |
| 7931973 | Manufacturing method of metal structure in multi-layer substrate and structure thereof | — | 2011-04-26 |