Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8065795 | Multi-layer circuit assembly and process for preparing the same | Alan Wang | 2011-11-29 |
| 8008188 | Method of forming solid blind vias through the dielectric coating on high density interconnect substrate materials | Alan E. Wang | 2011-08-30 |