Issued Patents 2011
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053676 | Substrate panel having a plurality of substrate strips for semiconductor packages | — | 2011-11-08 |
| 8049339 | Semiconductor package having isolated inner lead | Yu-Mei Hsu | 2011-11-01 |
| 7972904 | Wafer level packaging method | — | 2011-07-05 |
| 7952168 | Substrate strip for semiconductor packages | — | 2011-05-31 |
| 7927919 | Semiconductor packaging method to save interposer | Li-Chih Fang, Ronald Takao Iwata | 2011-04-19 |
| 7919851 | Laminate substrate and semiconductor package utilizing the substrate | — | 2011-04-05 |
| 7919715 | Circuit board ready to slot | — | 2011-04-05 |
| 7902663 | Semiconductor package having stepwise depression in substrate | — | 2011-03-08 |