Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8048721 | Method for filling multi-layer chip-stacked gaps | Wei-Chih Chien | 2011-11-01 |
| 7902666 | Flip chip device having soldered metal posts by surface mounting | Jui-Ching Hsu | 2011-03-08 |
| 7879648 | Fabrication method for high pin count chip package | Hsing-Der Chung | 2011-02-01 |