Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8040690 | Inner-connecting structure of lead frame and its connecting method | — | 2011-10-18 |
| 7884472 | Semiconductor package having substrate ID code and its fabricating method | Chin-Ti Chen, Ching-Wei Hung, Bing YU | 2011-02-08 |