Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8003216 | Heat-conductive dielectric polymer material and heat dissipation substrate containing the same | David Shau Chew Wang, Jyh Ming Yu, Fu Hua Chu | 2011-08-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8003216 | Heat-conductive dielectric polymer material and heat dissipation substrate containing the same | David Shau Chew Wang, Jyh Ming Yu, Fu Hua Chu | 2011-08-23 |