Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7989081 | Resin composite copper foil, printed wiring board, and production processes thereof | Mitsuru Nozaki, Morio Gaku, Yasuo Tanaka, Yasuo Kikuchi, Masashi Yano | 2011-08-02 |
| 7892651 | Resin composite metal foil, laminate and process for the production of printed wiring board using the laminate | Takabumi Omori, Mitsuru Nozaki, Masashi Yano | 2011-02-22 |