Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7989962 | Bonding pad for preventing pad peeling | — | 2011-08-02 |
| 7863177 | Fuse in a semiconductor device and method for fabricating the same | Won Ho Shin | 2011-01-04 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7989962 | Bonding pad for preventing pad peeling | — | 2011-08-02 |
| 7863177 | Fuse in a semiconductor device and method for fabricating the same | Won Ho Shin | 2011-01-04 |