Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7968991 | Stacked package module and board having exposed ends | Mao-Hua Yeh, Wang-Hsiang Tsai | 2011-06-28 |
| 7880296 | Chip carrier structure having semiconductor chip embedded therein and metal layer formed thereon | Zao-Kuo Lai | 2011-02-01 |