Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8033016 | Method for manufacturing an electrode and electrode component mounted body | Kunio Hibino, Yoshihiro Tomura, Kazuhiro Nishikawa | 2011-10-11 |
| 8018731 | Interconnect substrate and electronic circuit mounted structure | Daisuke Sakurai, Masato Mori | 2011-09-13 |
| 7928566 | Conductive bump, method for manufacturing the conductive bump, semiconductor device and method for manufacturing the semiconductor device | Daisuke Sakurai | 2011-04-19 |