Issued Patents 2011
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8083121 | Paste for soldering and soldering method using the same | Tadashi Maeda | 2011-12-27 |
| 8034447 | Electronic components mounting adhesive and electronic components mounting structure | Hideki Eifuku, Kouji Motomura | 2011-10-11 |
| 8025205 | Electronic component mounting method | Hideki Eifuku, Osamu Suzuki, Satomi Kawamoto | 2011-09-27 |
| 8018074 | Components joining method and components joining structure | Hideki Eifuku, Yoshiyuki Wada | 2011-09-13 |
| 7966721 | Electronic component mounting method and electronic component mounting device | Yoshiyuki Wada | 2011-06-28 |
| 7886432 | Electric components connecting method | Hideki Eifuku | 2011-02-15 |