Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8062750 | Epoxy resin composition for prepreg, prepreg and multilayered printed wiring board | Hidetsugu Motobe, Yoshihiko Nakamura, Takeshi Koizumi | 2011-11-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8062750 | Epoxy resin composition for prepreg, prepreg and multilayered printed wiring board | Hidetsugu Motobe, Yoshihiko Nakamura, Takeshi Koizumi | 2011-11-22 |