Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8052153 | Seal device | Yasuhisa Arita, Yasuhiro Ikeda | 2011-11-08 |
| 8028886 | Bonding tool, electronic component mounting apparatus and electronic component mounting method | Katsuhiko Watanabe, Ryo Fujita | 2011-10-04 |
| 7980444 | Electronic component mounting head, and apparatus and method for mounting electronic component | Hiroshi Nasu, Katsuhiko Watanabe, Hiroyuki Kobayashi | 2011-07-19 |