Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8008129 | Method of making semiconductor device packaged by sealing resin member | Shigeru Yamada, Yasushi Shiraishi | 2011-08-30 |
| 7977229 | Method for fabricating resin-molded semiconductor device having posts with bumps | Yasushi Shiraishi, Yasuo Tanaka | 2011-07-12 |
| 7928546 | Semiconductor device and manufacturing method thereof | Morifumi Ohno, Motoki Kobayashi, Makoto Terui, Mitsuhiko Ogihara | 2011-04-19 |