Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7998852 | Methods for forming an RF device with trench under bond pad feature | Margaret A. Szymanowski, Michele L. Miera, Xiaowei Ren, Wayne R. Burger, Mark Arwyn Bennett +1 more | 2011-08-16 |