Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8042441 | Method for cutting protective tape of semiconductor wafer and apparatus for cutting the protective tape | Takashi Nishinohama, Masayuki Yamamoto | 2011-10-25 |
| 7987886 | Protective tape joining apparatus | Masayuki Yamamoto | 2011-08-02 |
| 7987888 | Releasing method and releasing apparatus of work having adhesive tape | Masayuki Yamamoto | 2011-08-02 |
| 7896050 | Apparatus for cutting the protective tape of semiconductor wafer | Masayuki Yamamoto | 2011-03-01 |