Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7977789 | Bump with multiple vias for semiconductor package and fabrication method thereof, and semiconductor package utilizing the same | — | 2011-07-12 |
| 7919833 | Semiconductor package having a crack-propagation preventing unit | — | 2011-04-05 |
| 7906842 | Wafer level system in package and fabrication method thereof | — | 2011-03-15 |