Issued Patents 2011
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8048493 | Method of forming piezoelectric resin film | Takeshi Habu | 2011-11-01 |
| 7993732 | Heat-sensitive pressure-sensitive adhesive and heat-sensitive adhesive material | Mitsunobu Morita, Takehito Yamaguchi, Kunio Hayakawa, Hitoshi Shimbo, Yutaka Kuga | 2011-08-09 |
| 7989529 | Thermosensitive adhesive composition, method of manufacturing the same and thermosensitive adhesive material | Takehito Yamaguchi, Hiroaki Matsui, Mitsunobu Morita, Kunio Hayakawa | 2011-08-02 |
| 7982271 | Semiconductor device | Naozumi Morino, Atsushi Hiraiwa, Kazutoshi Oku, Toshiaki Ito, Motoshige Igarashi +3 more | 2011-07-19 |
| 7900172 | Method and apparatus for analyzing power consumption | Junichi Niitsuma, Ryuji Fujita, Kazuhide Tamaki | 2011-03-01 |
| 7882458 | Power consumption analyzing method and computer-readable storage medium | Kazuhide Tamaki, Ryuji Fujita, Junichi Niitsuma | 2011-02-01 |