Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7893006 | Systems and methods for solution-based deposition of metallic cap layers for high temperature superconductor wires | Yibing Huang, Thomas Kodenkandath, Martin W. Rupich, Wei Zhang | 2011-02-22 |