Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8064202 | Sandwich structure with double-sided cooling and EMI shielding | Jian Yin, Kaiwei Yao | 2011-11-22 |
| 7999364 | Method and flip chip structure for power devices | — | 2011-08-16 |
| 7944048 | Chip scale package for power devices and method for making the same | — | 2011-05-17 |