Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8030751 | Board-on-chip type substrates with conductive traces in multiple planes and semiconductor device packages including such substrates | David J. Corisis, Chin Hui Chong | 2011-10-04 |
| 7915077 | Methods of making metal core foldover package structures | David J. Corisis, Chin Hui Chong | 2011-03-29 |
| 7915726 | Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices | Chin Hui Chong, David J. Corisis | 2011-03-29 |
| 7888185 | Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device | David J. Corisis, Chin Hui Chong | 2011-02-15 |