Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8008762 | Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor | Todd O. Bolken | 2011-08-30 |
| 7998305 | Electrical interconnect using locally conductive adhesive | Steve W. Heppler | 2011-08-16 |
| 7939449 | Methods of forming hybrid conductive vias including small dimension active surface ends and larger dimension back side ends | Jonathon G. Greenwood | 2011-05-10 |