Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084853 | Semiconductor flip chip package utilizing wire bonding for net switching | — | 2011-12-27 |
| 8044496 | QFN semiconductor package | Nan-Cheng Chen | 2011-10-25 |
| 8039319 | Method for fabricating QFN semiconductor package | Nan-Cheng Chen | 2011-10-18 |
| 8039933 | QFN semiconductor package | Nan-Cheng Chen | 2011-10-18 |
| 7884481 | Semiconductor chip package and method for designing the same | — | 2011-02-08 |