Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8035226 | Wafer level package integrated circuit incorporating solder balls containing an organic plastic-core | Duane Thomas Wilcoxen, Christo Bojkov, Steve Detlev Cate | 2011-10-11 |