Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058106 | MEMS device package with vacuum cavity by two-step solder reflow method | Mei-Ling Wu | 2011-11-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058106 | MEMS device package with vacuum cavity by two-step solder reflow method | Mei-Ling Wu | 2011-11-15 |