Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7968999 | Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesive | Zeki Z. Celik, Zafer Kutlu | 2011-06-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7968999 | Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesive | Zeki Z. Celik, Zafer Kutlu | 2011-06-28 |