Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076181 | Lead plating technique for singulated IC packages | Lothar Maier | 2011-12-13 |
| 7960845 | Flexible contactless wire bonding structure and methodology for semiconductor device | — | 2011-06-14 |
| 7902665 | Semiconductor device having a suspended isolating interconnect | — | 2011-03-08 |