Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7956449 | Stacked integrated circuit package system | Oh Han Kim | 2011-06-07 |
| 7906371 | Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield | OhHan Kim, Sunmi Kim | 2011-03-15 |