Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7964671 | Thermally curable composite resin composition, prepreg, composite film and laminated material for circuit having the same | Woo Sung Lee, Seong Dae Park, Se Hoon Park | 2011-06-21 |