Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7994041 | Method of manufacturing stacked semiconductor package using improved technique of forming through via | Hyun Seo Kang | 2011-08-09 |
KL
Kwon-Seob Lim
Overall (2011): #238,466 of 364,097Top 70%
1
Patents 2011