HF

Hiromi Fujisawa

KA Kaijo: 2 patents #1 of 10Top 10%
Overall (2011): #97,203 of 364,097Top 30%
2
Patents 2011

Issued Patents 2011

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
8042725 Wire bonding method, wire bonding apparatus, and wire bonding control program Toru Arahata, Shinobu Ishii 2011-10-25
8016182 Wire loop, semiconductor device having same and wire bonding method Mizuho Shirato, Tadahisa Akita 2011-09-13