Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7939171 | Metal-containing resin particle, metal-containing resin layer, method of forming metal-containing resin layer, and substrate for electronic circuit | Hideo Aoki, Chiaki Takubo | 2011-05-10 |
| 7877871 | Method of manufacturing an electronic circuit formed on a substrate | Hideo Aoki, Chiaki Takubo, Toshiaki Yamauchi, Koji Imamiya, Hiroshi Hashizume | 2011-02-01 |