Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8018066 | Semiconductor device and method of manufacturing the same | Kyo Go, Kozo Harada, Shinji Baba | 2011-09-13 |
| 7951701 | Semiconductor device having elastic solder bump to prevent disconnection | — | 2011-05-31 |