Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8013438 | Semiconductor package with a stiffening member supporting a thermal heat spreader | Kum-Weng Loo | 2011-09-06 |
| 7956475 | Step cavity for enhanced drop test performance in ball grid array package | Kim-Yong Goh | 2011-06-07 |
| 7919361 | Semiconductor package with position member | Kum-Weng Loo, Chek-Lim Kho | 2011-04-05 |