Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8078438 | Method for simulating thermal resistance value of thermal test die | Yi-Lun Cheng | 2011-12-13 |
| 7954541 | Heat dissipation module | Chih-Kai Yang, Huang-Cheng Ke, Yu-Chih Cheng, Cheng-Shang Chou | 2011-06-07 |
| 7946336 | Heat sink structure | Shaw-Fuu Wang, Ting-Chiang Huang, Sheng-Jie Syu | 2011-05-24 |
| 7940528 | Electronic device and heat sink thereof | Ting-Chiang Huang, Shaw-Fuu Wang, Sheng-Jie Syu | 2011-05-10 |