Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7923349 | Wafer level surface passivation of stackable integrated circuit chips | Simon J. S. McElrea, Terrence Caskey, Scott McGrath, DeAnn Eileen Melcher, Reynaldo Co +5 more | 2011-04-12 |
| 7863159 | Semiconductor die separation method | Reynaldo Co, DeAnn Eileen Melcher, Weiping Pan | 2011-01-04 |