Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084856 | Thermal spacer for stacked die package thermal management | — | 2011-12-27 |
| 8054629 | Microfins for cooling an ultramobile device | Zhihua Li, Cheng-Chieh Hsieh, Hakan Erturk, George Chen | 2011-11-08 |