Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7919859 | Copper die bumps with electromigration cap and plated solder | Ting Zhong, Mark Bohr | 2011-04-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7919859 | Copper die bumps with electromigration cap and plated solder | Ting Zhong, Mark Bohr | 2011-04-05 |