Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8067256 | Method of making microelectronic package using integrated heat spreader stiffener panel and microelectronic package formed according to the method | James Mellody | 2011-11-29 |
| 8013439 | Injection molded metal stiffener for packaging applications | — | 2011-09-06 |
| 7996989 | Heat dissipating device with preselected designed interface for thermal interface materials | Ashay Dani, Christopher L. Rumer, Thomas J. Fitzgerald | 2011-08-16 |